Single Inline Packages (SIP) & SIP DC-DC Converters

SIP PACKAGE

Often referred to as a single inline pin package (SIPP), a single inline package (SIP) is used to house multiple resistors and RAM chips with a standard pin configuration. SIPs allow RAM chips to be mounted on a compact board using surface mounting or dual in-line package (DIP) processes, featuring a single row of pin leads that connect to a specific socket on a system or expansion board.

SIPs are commonly associated with memory units, typically supporting a maximum I/O count of 24, which is smaller than the 64 I/O count found in DIPs. They are also used in small-form parallel-array systems, like resistor and diode arrays, as well as in larger hybrid systems, such as oscillators and clocks.

SIPs are made from ceramic or plastic, with lead counts ranging from four to 64. There are three forms of SIPs: molded, conformal coated, and uncoated. We offer a wide range of SIP DC-DC converters, collaborating with leading technology suppliers like CINCON, ADVANCED ENERGY, MINMAX, and COSEL. This partnership allows us to tailor solutions that meet almost any requirement.

SIP PACKAGE

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